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High Density Interconnect Arrays The new SEARAY high-density interconnectclass arrays from Samtec, have been announcedclass by Part of the SEAM/SEAR Series, the new devices have the same footprint, providing a solid grid of contacts on 1.27mm pitch and up to 500 I/Os. They also complement Samtec's popular SamArray Series connectors, delivering added features and stack heights. Lower insertion and extraction forces make the SEARAY Series more user-friendly, and with the choice of traditional tin-lead alloy or RoHS-compliant, lead-free tail solder crimps, it is also highly verstile. SEARAY high density interconnects are available in stack heights of 7, 8.5 and 10mm with array sizes of 8 or 10 rows by 20, 30, 40 or 50 pins per row. |
tanja.selbherr@de.ttiinc.com www.ttieurope.com
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