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Innovative eSIP Power Package A new series of AC-DC power conversion ICs in the new eSIP-7C Eco-Single-Inline-Package, has been announced by , the leader in high-voltage analog integrated circuits for power conversion. Introduced as the TOPSwitch-HX, this new package exhibits the same low thermal impedance as the traditional TO-220, yet stands less than 10mm above the PCB. This is a function of the eSIP-based design, which reduces the overall height of the power supply in support of increasing market demand for slimmer electronic products such as LCD monitors, flat screen TVs and set-top boxes. |
In common with other Power Integrations products, the heatsink attached to the eSIP package is at Source potential, and is therefore electrically quiet without an insulating pad, greatly reducing system EMI and assembly cost. Additionally, the eSIP package offers the benefit of reducing power supply manufacturing costs. Creepage and clearance, and therefore long-term reliability, is also improved with the eSIP package, since the pin layout is optimized to increase pin separation, and the stepped package design increases creepage distance. An easy-to-use, low-cost clip cuts heatsink assembly time and improves package to heatsink contact repeatability, ensuring consistently good thermal performance. The clip-mounted eSIP passes shock and vibration tests to IEC 60068.
EDI-new-products-08-04-08 |
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